The latest advancements in temperature-sensing technology have transformed PCB assembly by eliminating the need for adhesives in thermocouple attachment.
In the domain of large surface mount packages, the complexity of rework procedures, particularly applying heat to peripheral lead attach areas, presents challenges. This complexity amplifies with Ball Grid Arrays (BGAs), where intricate physical and electrical connections are established through grids of solder balls beneath components. Achieving an accurate temperature profile requires placing a thermocouple against a pad near the BGA’s center. Traditional methods face limitations, especially when BGAs lack adequate clearance underneath, leading to uncertainty in connecting the thermocouple to the central ball.
Conventional techniques involve drilling or milling a hole through the PCB’s back to access a pad near a central ball and attaching a thermocouple beneath it. Although effective, these methods are time-consuming and intricate.
An innovative approach involves drilling a 1/32 hole through the PCB’s back near a central ball. Using a specialized thermocouple probe called a “Temprobe,” it is clipped to the PCB’s edge with its probe positioned underneath. The Temprobe’s thermocouple tip is inserted into the hole against the pad. Simultaneously, a second thermocouple probe is clipped to the PCB’s top side, with its thermocouple tip resting on a pad near the BGA. This novel setup enables precise profiling and heating of the PCB to the required temperature, measured by both thermocouple probes simultaneously.
For BGA profile verification, a Temprobe can be clipped to a production PCB, placed on the reference point, and run through the profiling process. This data is then compared to the original reference profile for validation. This groundbreaking approach eliminates the need for soldering, bonding, or taping thermocouples to the PCB, streamlining work processes, and making PCB assembly faster and more manageable.
At Gelco EMS, we’re committed to implementing pioneering technologies to streamline and optimize PCB assembly processes. Our dedication to innovation ensures the delivery of efficient, reliable, and forward-thinking solutions that meet our clients’ evolving needs.
As the New Year approaches, Gelco EMS extends warm wishes for a prosperous and innovative year ahead. May the coming year be filled with breakthroughs, success, and technological advancements for all our partners and clients.
