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Key Factors Influencing The Success And Failure Of New Product Introduction (NPI)

16Sep
by Admin  
0

The success of New Product Introduction (NPI) is critical for original equipment manufacturers (OEMs) striving to remain competitive in today’s market. NPI encompasses the journey from an innovative concept to a fully functional electronic product, involving intricate processes like design, prototyping, manufacturing, assembly, testing, and inspection. However, even with substantial investments in resources, time, and effort, many NPI projects encounter unexpected pitfalls. This article discusses the key factors that determine the success or failure of NPIs and offers tips for optimizing the process.

Understanding the High Stakes of NPI

Introducing a new product is no small feat. Studies indicate that an NPI can take up to 24 months to complete, requiring OEMs to invest nearly 25% of their resources in the project. Despite these efforts, some NPIs fail, often due to a lack of preparation, inadequate checks, or hasty decisions. So, what sets successful NPIs apart from those that fall short? Here are some critical factors that OEMs must focus on to ensure their NPI’s success.

1. Design for Assembly (DFA) and Design for Manufacturing (DFM) Checks

The journey of NPI begins with translating a concept into detailed design files, including schematics, Gerber files, NC drill files, Bill of Materials (BOM), assembly instructions, and CAD drawings. At this stage, two essential checks need to be conducted:

  • DFA (Design for Assembly) Check: Performed by design engineers, this check focuses on simplifying the product assembly process. It ensures that components are easily accessible, align correctly, and fit seamlessly into the overall design.
  • DFM (Design for Manufacturing) Check: Carried out by manufacturing engineers, this check assesses the design’s feasibility for large-scale production. It examines aspects like materials, layer counts, copper weights, and spacing to ensure efficient manufacturing.

Conducting these checks early in the process can identify potential design issues, enhance product viability, reduce costs, and accelerate time-to-market.

2. Selecting the Right Assembly Type

The assembly process is a crucial phase in NPI, and OEMs typically have three options to choose from when partnering with contract manufacturers:

  • Kitted Assembly: The client provides all components, including electronic parts, bare circuit boards, and design files. Quality assurance becomes the client’s responsibility in this case, as the manufacturer only handles assembly.
  • Partial Turnkey Assembly: Both the client and the manufacturer collaborate. The client supplies critical and expensive parts, such as ICs, LEDs, and connectors, while the manufacturer sources the more affordable components. This arrangement allows for shared responsibility in component quality.
  • Full Turnkey Assembly: The manufacturer takes charge of sourcing all components based on the design files provided by the client. This option reduces client involvement, but it emphasizes the need for a reliable manufacturer who can ensure quality sourcing.

Regardless of the assembly type chosen, it’s vital to check the availability and quality of components through thorough inspection and testing.

3. Manufacturing and Assembly Steps

The manufacturing process is complex and consists of various steps that directly influence the performance and reliability of the final electronic product. Some of the critical manufacturing steps include:

  • Layer Count: The number of layers in the PCB, influencing its complexity and performance.
  • Copper Weight: Affects the PCB’s current-carrying capacity and durability.
  • Substrate Material: Determines the PCB’s mechanical and thermal properties.
  • Minimum Tracing/Spacing: Ensures proper signal transmission and minimizes interference.
  • Solder Mask: Protects the copper traces and prevents solder bridging.
  • Surface Finish: Impacts solderability and component placement.

Similarly, during the assembly phase, attention must be paid to the following:

  • Surface Mount and Through-Hole Assembly: The accuracy and precision in placing components.
  • Component Packages: The compatibility of different component packages with the PCB layout.
  • Quality Grade: The overall reliability of the assembly, especially for mission-critical applications.
4. Testing and Inspection for Quality Assurance

Comprehensive testing and inspection are fundamental to ensuring the quality of the final product. Here’s how quality is assured:

  • Bare PCB Testing: Techniques like electrical testing, flying probe testing, and bed-of-nail testing are used to verify the functionality of the bare PCB.
  • Assembly Testing: Advanced inspection methods, such as Automated X-ray Inspection (AXI) and Automated Optical Inspection (AOI), help detect potential issues like solder defects, misaligned components, and faulty connections.

These testing phases help identify errors early, reduce costly rework, and ensure that only fully functional products proceed to the market.

Partnering with a Trusted Contract Manufacturer

Whether it’s a new product launch or a recurring PCB fabrication project, success hinges on collaborating with an experienced contract manufacturer. A trusted partner guides you through every phase of the NPI process, from design and engineering to manufacturing and assembly. At Gelco EMS, we specialize in delivering comprehensive NPI solutions that help our clients bring innovative products to market efficiently and cost-effectively.

By leveraging our extensive experience in PCB design, manufacturing, and assembly, we ensure that each product meets stringent quality standards, performs as expected, and achieves a successful market launch.

Ready to turn your NPI into a success? Contact Gelco EMS today to discuss your project requirements and learn how our end-to-end solutions can make a difference.

 

Understanding The Importance Of Rapid PCB Prototyping With Gelco EMS

07Aug
by Admin  
0

Prototyping is a critical phase in product development across various industries, including electronics. A prototype represents a limited edition of a product manufactured before full-scale production. It helps in assessing several aspects of the product, such as design flaws, functionality, consistency, and areas of improvement. PCB manufacturers also produce prototypes of circuit boards before proceeding with large-scale production. With the advent of 3D printing and modeling, rapid prototyping has become an efficient method to create these prototypes quickly. This blog will discuss the significance of rapid PCB prototyping and how it works for different projects.

The Role of Rapid PCB Prototyping in Project Development

When integrating a PCB assembly into an electronic or mechanical product, having a clear vision of the final product is essential. Rapid prototyping allows you to create a circuit board prototype closely resembling the final product. This process is often carried out through additive manufacturing, commonly known as 3D printing, among other methods.

Key Methods of Rapid PCB Prototyping

Rapid PCB prototyping involves several advanced methods to ensure precise and efficient production. One primary method is high-speed machining, including subtractive and compressive techniques. In subtractive machining, high-speed grinding and milling carve out the necessary portions of the material. On the other hand, compressive machining involves compressing fluid substances into board molds at high temperatures, which are then cooled to solidify, using techniques like sintering and molding.

Another significant method is 3D printing, or additive manufacturing, which has revolutionised PCB prototyping with its cost-effectiveness and precision. This method primarily uses the extrusion process, where materials such as graphene substrate, embedded copper filament, and conductive gels are utilized. The extruder head applies conductive metals like copper onto the circuit board, connecting with the open and flowing wires, forming PCB layers, and establishing connectivity. Additionally, inkjet printing is sometimes used for creating 2D models, although 3D printing is more common due to its efficiency in handling complex designs.

Both methods prioritize material efficiency, using only the required amount and types of materials, which helps in reducing wastage. These advanced techniques ensure that rapid prototyping is not only cost-effective but also capable of producing highly complex designs, making it suitable for mission-critical applications in sectors like aerospace.

Benefits of Rapid PCB Prototyping

  • Cost-Effective: Rapid prototyping helps save costs and reduce production losses by identifying design flaws and functional issues early in the development process.
  • Time-Saving: Prototyping accelerates the development process, allowing faster iterations and quicker time-to-market.
  • Design Validation: It ensures that the design meets all functional and performance requirements before mass production.
  • Complex Designs: 3D printing can handle complex designs, making it suitable for mission-critical applications in sectors like aerospace.

Conclusion

For successful rapid PCB prototyping, it is crucial to partner with a reliable service provider like Gelco EMS. We offer end-to-end solutions, from the ideation stage to the integration of the PCB assembly into your product. Our services include material selection, design assistance, and technical support to ensure the highest quality and performance of your prototypes.

At Gelco EMS, we design, fabricate, and assemble various types of PCBs. Our rapid prototyping services ensure that you receive accurate prototypes before proceeding with full-scale production, minimizing risks and ensuring optimal product performance.

Contact us today to learn more about our rapid PCB prototyping services and how we can help you bring your electronic and electromechanical products to life with precision and efficiency.

POST-AOI Automation: What Are Your Options?

08May
by Admin  
0

In the electronics industry, maximizing production profitability is a constant concern for manufacturers, regardless of their size or degree of automation. One area where significant gains can be made is in the automation of post-AOI processes. In this article, we will discuss the options available for optimizing post-AOI automation processes and their potential benefits.

The first and most important step in improving post-AOI automation is moving from batch AOI to inline AOI. While batch systems may be cheaper initially, the costs of a skilled operator’s wages over the lifetime of the machine are much higher than an inline system, which requires far less human intervention.

Once the inline AOI system is in place, there are several options available for post-AOI automation:

NG Conveyor and NG Workstation:

The most common method for separating NG (non-good) PCBAs from good PCBAs is the NG Conveyor. These conveyors have a pin lift mechanism that moves NG PCBAs from the good transfer conveyor to the NG position above. NG Conveyors can be equipped with up to three NG positions, and alarms can be set to signal line operators to remove the NG PCBAs for processing.

NG Workstations provide additional automation by bringing the review station to the SMT line. The workstation is equipped with a review station screen and PC, a mounted optical camera, and a screen on a floating X, Y gantry, allowing for all processing and reviews to take place on the line.

NG Buffer:

The NG Magazine Buffer is popular among OEM manufacturers and CEMs with high automation or throughput ambitions. This unit offloads perpendicular to the SMT line and provides the highest level of automation and efficiency, allowing full magazine racks to be taken to the review station and reviewed in bulk for processing. Alarms can be set to reduce unwanted scrap, which will pause production.

Split End of Line Unloader:

This option is great for those who want the functionality of the NG Buffer but do not have the floor space or budget to invest in one. With a PLC modification to an unloader immediately downstream from AOI, certain magazine positions can be allocated to NG products, which can be separated from GD (good) products and sent to review. If there are more NG PCBAs than slots, the unloader moves to the next empty rack to avoid human error on separation.

In conclusion, as boards become more complex, the inspection process’s accuracy and automation become increasingly important to ensure electronic components’ longevity. The limitations of optical inspection systems cannot be overlooked, as they can cause false calls and escapes. 3D AOI systems are the answer, but it is crucial to look for systems that combine technologies with superior hardware to provide true 3D optical inspection solutions and help guarantee that the inspection process is faultless. By optimising post-AOI automation, manufacturers can increase their profitability while ensuring high-quality electronic components.

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