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Accelerate Your Prototyping with Gelco EMS’s Quick Turn PCB Assembly Services

04Sep
by Admin  
0

When it comes to creating customised prototype circuit boards on a tight schedule, Quick Turn PCB assembly services are the ace up your sleeve. These services offer a lifeline for businesses seeking faster turnarounds without breaking the bank. Gelco EMS specialises in delivering top-notch Quick Turn PCB assembly services, providing you with various efficient ways to meet your project’s unique needs and specifications.

Why Gelco EMS for Quick Turn PCB Assembly?

At Gelco EMS, we take pride in being a trusted name in the industry, offering a range of Quick Turn PCB assembly services that are not only prompt but also tailored to meet our customers’ needs. Here’s why you should choose us:

Dedicated to Meeting Deadlines: We understand the importance of meeting tight project deadlines. Our team works diligently to assemble Quick Turn PCBs promptly, ensuring your projects stay on track.

Expertise in 2-layer and 4-layer Co-op Panels: Whether you require assembly for 2-layer or 4-layer Co-op panels, both bare and finished, we’ve got you covered. Our expertise extends to various panel types, giving you flexibility in your project designs.

Customer-Centric Approach: Your satisfaction is our priority. Our dedicated customer support team is here to assist you, troubleshoot any issues, and answer any questions you may have regarding Quick Turn PCBs.

Quick Turn PCB Services Offered: At Gelco EMS, we offer a range of Quick Turn PCB assembly services designed to cater to your needs:

  • Cost Efficiency with Co-op Panels: Our Co-op panels allow you to share assembly orders for both finished and bare boards. This collaborative approach helps distribute costs effectively, saving you money on material and setup expenses. We offer small-sized panels that can be rapidly filled, whether you need 2-layer or 4-layer Co-op panels.
  • Time Savings with Prototype Panels: For projects requiring lightning-fast turnaround times, our ingeniously designed Prototype circuit boards are the solution. These boards are optimised for quick turnarounds and instant ordering, ensuring you meet your deadlines without compromise.

Additional Value-Added Services

At Gelco EMS, we go the extra mile to provide you with added benefits such as:

  • Customised Quotes for PCBs: Get quotes tailored to your project’s unique requirements.
  • Fast Delivery: We understand the need for speed; our services include fast and reliable delivery.
  • Automatic File Verification: Rest easy knowing your files will be automatically verified for accuracy.
  • Cost-Effective 1-2 Layered Quick Turn PCB Assembly: We offer cost-effective assembly options for 1-2 layered PCBs.

Ready to get started with Gelco EMS’s Quick Turn PCB assembly services? Visit our website, place your order, and take advantage of instant tracking and delivery. Trust us to accelerate your prototyping projects while maintaining the highest standards of quality and efficiency. Gelco EMS is your partner for quick, reliable, and cost-effective PCB assembly.

Mastering the Art of Solder Paste Application in Surface Mount Assembly.

03Aug
by Admin  
0

The surface mount assembly process is a meticulous process where each step is vital. Each step contributes to the flawless functionality of electronic devices. Among these crucial steps, the application of solder paste to the printed circuit board (PCB) is the key to success. Accomplished through stencils or foils, this seemingly straightforward process requires meticulous considerations and expertise for optimal results.

A stencil, often crafted from thin stainless steel, is punctuated with a series of apertures designed to align precisely with the PCB layout. This unassuming tool wields immense power, accurately depositing solder paste onto surface mount pads. This deposition ensures solder joints meet the high standards of both electrical connectivity and mechanical robustness.

Design Considerations

The way the stencil is made is really important. It needs to be just the right thickness to allow the paste to come out smoothly from the holes. We also need to think about the size of the particles in the paste and how they come out of these holes. The following points must be ensured:

  • Stencil Thickness: Striking the right balance is crucial; a thickness of 4 to 8 thou ensures proper paste release from apertures and the desired solder joint volume. A simple formula guides the selection, while the particle size of the solder paste influences release efficiency.
  • Aperture Design: Careful aperture design prevents solder defects like bridging and beads. Apertures are often slightly smaller than pads, forming a gasket seal, while unique designs cater to specific needs, as seen in ‘home-plate’ apertures.
  • Stencil Material and Mounting: Stencil material matters, with stainless steel being common and nickel serving advanced designs. Coatings like NanoProTek enhance paste release. Multilevel stencils or ‘stepped’ stencils cater to diverse component sizes.
  • Stencil Alignment: Proper alignment ensures accurate paste print on pads, achieved through fiducial marks on both PCB and stencil.
  • PCB Design Specifics: Design choices, like window effects to manage heat-dissipating copper pads, ensure flawless application.

Efficiency:

In the electronics industry, efficiency is the heartbeat of success. Sub-optimal assembly processes, like inefficient surface mount operations at 20%, lead to cascading inefficiencies across the production line. These inefficiencies inflate costs, slow returns on investment, and hinder competitiveness. Larger batch sizes, excess parts, and delayed customer responses become unwelcome companions.

With heightened awareness and proactive measures, we can elevate the electronics industry to new heights of efficiency and excellence. By perfecting the solder paste application, we solidify the foundation for seamless assembly and superior device performance. As we progress, let’s embrace the intricacies, pioneer advancements, and shape an electronics industry that stands as a beacon of innovation, quality, and sustainability.

Conclusion:

In the realm of electronics manufacturing, where precision and innovation meet, the application of solder paste emerges as the keystone of success. By mastering this art, we unlock the potential for seamless assembly, ensuring the impeccable functioning of electronic devices that shape our modern world. As we navigate the intricacies of stencil design, material selection, and strategic placement, we pave the way for a future marked by efficient and sustainable electronics. In this journey, Gelco EMS stands as a beacon of expertise, committed to delivering top-tier solutions that run parallel to technological advancement with responsible practices.

Considerations For Choosing a Selective Soldering Process

03Jul
by Admin  
0

Selective soldering has become a crucial process in electronics manufacturing, automating the soldering of assemblies that would otherwise require hand soldering. When selecting a selective soldering machine, several parameters need to be considered to ensure an effective and efficient soldering process. In this blog post, we will explore the key factors that should be taken into account when choosing a selective soldering process.

  • PCB Size: The size of the PCB being processed plays a significant role in machine selection. Smaller PCBs can be processed using compact machines with the option of dual conveyors to increase throughput. Larger PCBs may require in-line machines with board handling capabilities for higher volume production.
  • Floor Space: The available floor space must be considered when selecting a selective soldering machine. Machines range in size from compact units to larger in-line systems, and the available space should align with the chosen machine’s dimensions.
  • Maintenance: The level of maintenance required can vary based on the technology employed within the solder pot. Machines using impellers to drive the solder may generate more dross, requiring regular removal. Opting for machines with electromagnets to drive the solder reduces maintenance needs and ensures a more stable wave for accurate soldering.
  • Solder Type: Selective soldering machines can accommodate various solder alloys. While some companies still use leaded solder, most prefer lead-free alloys. The pot temperature typically ranges between 270°C and 300°C for lead-free solder, although newer alloys are available that operate at lower temperatures, around 250°C.
  • Solder Pots: To optimise the selective soldering process, manufacturers often offer the option to add solder modules to the system. Machines may use multiple solder pots per module, allowing different solder alloys, variable Z-axis configurations, and variable Y-axis positions for simultaneous soldering of multiple PCBs.
  • Nozzles: The versatility of selective soldering lies in its ability to reach areas that are challenging to solder manually. A wide range of nozzles is available, varying in diameter and length. It’s important to consider the process time and nozzle wear when selecting the appropriate size and type of nozzle.
  • Nitrogen Supply: To prevent oxide formation and maintain solder quality, a high-purity nitrogen atmosphere is required. Nitrogen can be supplied through pressurised bottles, liquid nitrogen tanks, or locally generated sources. While each method has associated costs and safety considerations, locally generated nitrogen is often preferred due to its long-term cost-effectiveness and reduced safety concerns.
  • Flux: Flux is essential for cleaning metal surfaces and creating acceptable solder joints. Different flux types are available, categorised based on activity, solids content, and material type. Low-solid/no-clean fluxes are commonly used in selective soldering processes. Sufficient flux application is necessary for optimal solder hole fill and reliable soldering.
  • Pre-heating: The preheating stage serves several purposes, including activating and drying the flux, facilitating solder flow, minimising the effect of large copper planes, and reducing the risk of thermal shock to components. Infra-red preheating is often used, and closed-loop control with a pyrometer ensures accurate temperature control.
  • PCB Handling: For larger volume production using in-line selective soldering systems, PCB handling becomes essential to manage the flow of assemblies. Depending on the requirements, a combination of magazine PCB line loaders and unloaders can be integrated into the process.
  • Machine Options: Various machine options are available to enhance process repeatability, simplify machine operation, and improve overall efficiency. These options include visual inspection modules, automatic conveyor width adjustment, automatic wave height checks, automatic nozzle cleaning, automatic solder level checks, PCB warp compensation, and closed-loop control of heating elements.
  • Machine Configuration: The type and mix of assemblies being processed dictate the machine configuration. High-volume, low-mix production may prioritise speed, while low-volume, high-mix production requires flexibility. Choosing a machine configuration that aligns with the specific production requirements is crucial.

In conclusion, by carefully considering these parameters, electronics manufacturers can achieve accurate, repeatable, and efficient soldering processes, resulting in high-quality assemblies and a positive return on investment. Gelco EMS, as a trusted leader in selective soldering processes, offers tailored solutions that ensure accuracy, repeatability, and efficiency for electronics manufacturers. With advanced technology, expertise, and a commitment to excellence, Gelco EMS delivers high-quality assemblies and a positive return on investment. Choose Gelco EMS for reliable and optimised selective solder.

Understanding Selective Soldering

12Jun
by Admin  
0

As PCB assemblies become increasingly complex with surface mount components on both sides of the board, traditional soldering methods face challenges in automating the soldering of through-hole components. Hand soldering, often used as an alternative, can lead to inconsistent results and quality problems, resulting in higher manufacturing costs and longer lead times. In such cases, selective soldering has emerged as a preferred solution, offering greater efficiency, improved quality, and reduced manufacturing costs. In this blog post, we will explore the concept of selective soldering, its process, and its advantages over traditional methods.

Selective soldering is a targeted soldering process that focuses on specific electronic components on a PCB. Using a programmed image of the PCB, lines are drawn to indicate where flux and solder are to be applied, selecting the components to be soldered. This method allows for precise control and eliminates the need for hand soldering.

Selective Soldering Process:

Similar to wave soldering, the selective soldering process involves flux application, preheating, and soldering. However, there are key differences in how these steps are executed. Instead of coating the entire PCB with flux, only the components to be soldered are fluxed. The preheating stage raises the assembly’s temperature, preparing it for soldering. In the soldering stage, the PCB is exposed to a molten wave of solder, but unlike wave soldering, individual connections encounter the wave one after the other. This slower, more precise process allows for the independent configuration of variables for each position to be soldered.

Challenges Addressed by Selective Soldering:

One of the primary challenges that selective soldering overcomes is the clearance between surface mount components and through-hole component pads. In traditional wave soldering, clearance requirements can limit the use of this method. However, selective soldering offers more flexibility, with minimum clearance requirements ranging from 3mm to as low as 1mm, depending on the board design and the machine being used.

Advantages of Selective Soldering:
  1. Improved Quality: Selective soldering significantly reduces quality concerns associated with hand soldering. The automated process ensures consistency, resulting in reliable and defect-free solder joints.
  2. Faster Soldering: Selective soldering allows for faster soldering of through-hole components compared to manual soldering. This speeds up the manufacturing process, leading to reduced lead times and increased productivity.
  3. Cost Efficiency: By eliminating the inconsistencies and quality issues associated with hand soldering, selective soldering reduces manufacturing costs in the long run. It minimizes rework and the need for additional inspections, leading to improved overall operational efficiency.
  4. Precise and Customizable: Selective soldering provides a high level of precision and customization. Each soldering position can be independently configured, ensuring optimal soldering conditions for every connection. This flexibility is particularly valuable for complex PCB assemblies with various component sizes and designs.

Selective soldering has become a preferred method for soldering through-hole components in complex PCB assemblies. By offering improved quality, faster soldering, and cost efficiency, selective soldering overcomes the limitations of traditional methods and streamlines the manufacturing process. As electronics assemblies continue to advance in complexity, selective soldering will play an increasingly vital role in meeting the demands of modern electronics manufacturing.

POST-AOI Automation: What Are Your Options?

08May
by Admin  
0

In the electronics industry, maximizing production profitability is a constant concern for manufacturers, regardless of their size or degree of automation. One area where significant gains can be made is in the automation of post-AOI processes. In this article, we will discuss the options available for optimizing post-AOI automation processes and their potential benefits.

The first and most important step in improving post-AOI automation is moving from batch AOI to inline AOI. While batch systems may be cheaper initially, the costs of a skilled operator’s wages over the lifetime of the machine are much higher than an inline system, which requires far less human intervention.

Once the inline AOI system is in place, there are several options available for post-AOI automation:

NG Conveyor and NG Workstation:

The most common method for separating NG (non-good) PCBAs from good PCBAs is the NG Conveyor. These conveyors have a pin lift mechanism that moves NG PCBAs from the good transfer conveyor to the NG position above. NG Conveyors can be equipped with up to three NG positions, and alarms can be set to signal line operators to remove the NG PCBAs for processing.

NG Workstations provide additional automation by bringing the review station to the SMT line. The workstation is equipped with a review station screen and PC, a mounted optical camera, and a screen on a floating X, Y gantry, allowing for all processing and reviews to take place on the line.

NG Buffer:

The NG Magazine Buffer is popular among OEM manufacturers and CEMs with high automation or throughput ambitions. This unit offloads perpendicular to the SMT line and provides the highest level of automation and efficiency, allowing full magazine racks to be taken to the review station and reviewed in bulk for processing. Alarms can be set to reduce unwanted scrap, which will pause production.

Split End of Line Unloader:

This option is great for those who want the functionality of the NG Buffer but do not have the floor space or budget to invest in one. With a PLC modification to an unloader immediately downstream from AOI, certain magazine positions can be allocated to NG products, which can be separated from GD (good) products and sent to review. If there are more NG PCBAs than slots, the unloader moves to the next empty rack to avoid human error on separation.

In conclusion, as boards become more complex, the inspection process’s accuracy and automation become increasingly important to ensure electronic components’ longevity. The limitations of optical inspection systems cannot be overlooked, as they can cause false calls and escapes. 3D AOI systems are the answer, but it is crucial to look for systems that combine technologies with superior hardware to provide true 3D optical inspection solutions and help guarantee that the inspection process is faultless. By optimising post-AOI automation, manufacturers can increase their profitability while ensuring high-quality electronic components.

Difference Between 2D & 3D AOI

06Apr
by Admin  
0

AOI stands for Automated Optical Inspection, which is a process used in the electronics industry to inspect printed circuit boards (PCBs) for defects. AOI machines use high-resolution cameras and sophisticated image analysis software to detect various types of defects, such as missing components, misaligned parts, soldering defects, and other issues that can impact the functionality and reliability of the PCB.

There are two main types of AOI systems: 2D AOI and 3D AOI. The main difference between them is the way they capture and process images of the PCB. But let’s peek into some common differences between the two:

  1. Image capture: In 2D AOI, the camera captures 2D images of the PCB from a single viewpoint, while in 3D AOI, the camera captures multiple images of the PCB from different angles, allowing the software to create a 3D model of the board.
  2. Depth perception: 2D AOI has limited depth perception since it captures images from a single viewpoint. This makes it difficult to detect defects in complex or densely populated PCBs. In contrast, 3D AOI has much better depth perception, making it easier to detect defects that are hidden from a single viewpoint.
  3. Speed: 2D AOI is generally faster than 3D AOI since it captures images from a single viewpoint. This makes it more suitable for high-volume production lines where speed is critical.
  4. Accuracy: 3D AOI is generally more accurate than 2D AOI since it can detect defects that are hidden from a single viewpoint. This makes it more suitable for applications that require a high level of accuracy.
  5. Cost: 3D AOI is generally more expensive than 2D AOI since it requires more sophisticated hardware and software. This makes it less suitable for applications that require a lower cost of production.

In summary, 2D AOI is faster and less expensive, but has limited depth perception, while 3D AOI is slower and more expensive, but provides better depth perception and accuracy. The choice between the two depends on the specific needs of the application, including the complexity of the PCB, the required inspection speed and accuracy, and the cost of production.

Automated Optical Inspection (Aoi)

08Mar
by Admin  
0

Automated Optical Inspection or the AOI process is the method of inspection gaining popularity with the increasing usage of microelectronics. Over time, it has become an integral solution for the SMT industry. But what exactly is the AOI process?

As the name suggests, it is an automated visual inspection of the PCB in manufacturing. Post the assembly of components on the PCB, it is important to inspect it for any defects. For this, the AOI machine is used. The Air machine is equipped with a camera system to scan for any defects on the board which could further lead to board failure. It can be used at any stage of manufacturing i.e. pre or post-reflow or during both to ensure a flawless placement of PCB.

AOI inspects the PCB for any area defects. It helps ensure accurate component placement by identifying any component offset, absence or presence of components, component skew, flipped or severely damaged components. It also checks the solder joints for excessive or missing solder joints and ensures that there isn’t any wrong part or foreign element present on the PCB.

Types of AOI Inspection

AOI processors are available in two categories, the 3D AOI which is the latest version and its predecessor i.e. the 2D AOI, which was introduced somewhere in the early 1980s.  Despite being an age-old technology, with regular modifications, the 2D AOI is still very much dominating the market. However, the increasing complexity of PCB and reduced size of the PCBs have put 3D AOI ahead of 2D AOI.

  • 2D AOI: It is the most commonly used technology with multiple high-resolution cameras, 10 to 15 MP resolution, and precise lenses equipped to inspect tall devices of more than 5mm. The technology makes use of sophisticated inspection algorithms to detect any possible defects on the PCB. It is highly in demand because of its flexible inspection capabilities and is cost-effective. But it stands incapable of providing volumetric measurement data and true-co-planarity inspection.
  • 3D AOI: It is the latest technology that uses laser measurement especially to provide a 3D measurement of height-sensitive devices. Over years, it has been used mostly to inspect solder paste deposition on PCBs right after the screen-printing process. It comes in handy in detecting co-planarity defects that may have been ignored when inspecting through the 2D AOI process. It has a lesser false call rate than the 2D AOI and is capable of providing volumetric measurement data and true-co-planarity inspection. But it is an emerging technology with shadowing issues and high cost.

Whether it is the 2D AOI or the 3D AOI Technology, both aid in ensuring the quality of the PCB by providing incomparable reliability, especially in the case of complex boards with thousands of solder joints and intricate components.

Key Aspects to An Effective Reflow Soldering Process

06Feb
by Admin  
0

The Reflow Soldering stage consists of pasting the surface mount components to printed circuit boards (PCBs). A sticky mixture of powdered solder and flux, called the solder paste is used to stick the components. It is a simple process where the components/PCB/solder paste are pre-heated to form acceptable solder joints. But one must be careful to avoid any damage due to overheating. In addition to that, there are other aspects one must be mindful of for an effective reflow soldering process:

Suitable Reflow Soldering Machine:

A wide range of reflow soldering machines can be found in the market. Each has a distinct character depending on the required line speed and design/material of the PCB assemblies to be processed. Be sure the selected oven is of a suitable size to handle the production rate. Based on the repeatability of the process, the load factor of the oven must be checked.

Based on the design of the PCB assembly choose the possible machine with available options, (a) based on the conveyor type, which could be a mesh conveyor or an edge conveyor (b) with closed-loop control for speed of convection fans and (c) Automatic control of conveyor and centre-board-support widths.

Acceptable Reflow Profile:

Each assembly needs to be considered separately in order to create an acceptable reflow profile. The type of solder paste, PCB material & its thickness, number of layers, amount of copper within the PCB, and number  & type of surface mount components, can affect how the reflow oven is programmed.

To attain an acceptable reflow profile, initially, a sample assembly is created by connecting multiple thermocouples in a number of locations which is passed through high temperatures and then the range of temperatures across the PCB is measured. The main aim is to transfer enough heat into the assembly to melt the solder and form the solder joints without causing any damage to components or PCB.

PCB/Component Footprint Design:

For an assembly to reflow smoothly, it is important to have a balanced footprint design. Make sure the size of tracks connecting a component footprint to the other is the same in size. Also, adding copper balancing to waste areas is recommended to avoid panel wrapping.

Carefully printed PCB using a well-designed Stencil:

Consistent deposit of solder paste onto the PCB is integral to an effective reflow soldering process. Any fault at this stage can lead to undesired results. An effective stencil design can avoid errors and help proceed with an effective reflow soldering process.

Repeatable Placement of Surface Mount Components:

Even a minute variation in the placement of the components can be disastrous. The processes must be equipped enough to provide repeatably. For this one must ensure a well-maintained pick-and-place machine with component packages taught in the correct way. The placement of surface mount components must be repeatable and reliable.   

Good quality PCB, components and solder paste:

Lastly, it is very important to ensure good quality products are being used during the process. Any compromise with the quality can lead to undesirable results.

Always remember an effective reflow soldering process is key to achieving your desired PCB. Be mindful of the above aspects and always go with a trusted brand like Gelco EMS when approaching PCB relating solutions!

How To Place Components On a Circuit Board?

12Dec
by Admin  
0

Component placement is one of the initial and most important stages of PCB designing. It must be done with utmost care in order to save time and avoid rework. Here are some tips to help the designer with effective component placement.

  1. Grouping and positioning of components: One of the most important tips is to group components with similar functions together as they generate the same amount of heat and other currents, and helps in maintaining temperature levels and avoiding any damage. For instance, PMICs, convertors, LDOs etc. can be grouped as a power management section. Then based on the group dynamics, the other sections can be placed. For example, the power supply section must be placed away from digital or analogue parts, and components that generate electromagnetic noise or radiation must be kept away from more sensitive signals, this helps increase the efficiency by allowing for better control of the return path. To increase the assembly process’s efficiency and reduce positioning errors, one must ensure that the ICs are all aligned in the same direction. A simple rule is to place all the components with similar functions in my direction. Another rule to keep in mind is the distance between sections and components. This prevents dangerous interference between the mixed signals. Also, make sure a space of at least 50mil is maintained between components. Another element that should be considered while placing the components is that components that handle high-speed signals must be grouped and placed at a short distance from each other to simplify the routing of the traces.
  1. Keeping components away from heat sources: It is always suggested to avoid placing other components close to power components that generate heat. For instance, MOSFETs, IGBTs, PMICs and voltage regulators generate a fair amount of heat, sometimes the rise in temperature can affect the functioning of other components. Therefore, try placing such components away from other components.
  1. Creating solid ground planes: The uniformity of the ground plane should always be maintained as they facilitate the onset of signal and power integrity issues. In any case, where maintaining uniformity isn’t possible, be extremely cautious when placing components across the interruption as that could cause an interruption of the return path for those signals and affect the functionality of the PCB. Also, avoid an excessive number of routes as that too could cause an interruption of the return path.
  2. Placement near the PCB edges: It is always advisable to place components that require screw fixing near the edges so as to avoid unwanted contact of cables with other components. In addition to that, make sure no component is placed too close to the edge, at least a gap of 100mil between each component and the edge of the board should be maintained.
  3. Enough space for the traces: With an increasing demand for compact-size portable technology, PCBs, too are required to be of the minimum dimensions. But, it is important to not be misled and to be aware that there is a limitation to the miniaturization of circuits. While designing your PCB, ensure it is of an optimal size where enough space is left to route all the traces.
  4. Thermal management: Lastly, the thermal management of the PCB is very important. Certain components generate a considerable amount of heat during their operation. If not placed properly, this could increase the overall temperature of the board and lead to burning or other damage. To avoid this situation, such components must be placed in the centre of the PCB. This helps in the thermal management of the PCB by evenly distributing the generated heat across the board.

We hope the above-suggested tips come in handy and help you fight out the common obstacles in building an efficient PCB. Gelco always seeks to present you with the best possible solutions and expert advice.

Key Aspects of the Component Placement Process

03Nov
by Admin  
0

Once the Solder Pasting is done and properly inspected, comes the turn of Component Placement. Each component is removed from its packing using a vacuum or gripper nozzle, checked by the vision system and placed in the desired location. This is an automated system done at a very high speed. The technology used for this phase depends highly on the types and design of the PCB being manufactured.

But to achieve a reliable and repeatable process, one must be considerate of certain aspects, these are:

  • Type of data available: One must be mindful while selecting the software for designing the PCB. They must possess the ability to output various types of data. The most commonly used are the Gerber data and the ‘CAD’ data. They are standard electronics industry file formats and are best for generating placement programs. They are used to communicate design information to PCB manufacturers
  • PCB design: How a PCB is designed and panelized is important for the component placement process. Here are some considerations:
    • Panel size: The machines have a specified maximum and minimum size for the panels they can process. Ensure your panel fits within the estimated size.
    • Handling strips: It is important to penalize the PCB as mostly the components are placed too close to the edge and for the convenience of the PCB handling mechanism within the various machines.
    • Fiducial marks: Simple shapes are placed within the track layer of the PCB, called the Fiducial marks. They help in avoiding any confusion of aspects and enable accurate positioning of all the components on the design board.
    • Component size and position: The components might vary in size, therefore using program optimizing software, one must ensure that the smaller components are placed before the larger ones to avoid any disturbance.
  • Nozzles: Nozzles are used to hold the component securely between the picking and placement steps. Based on the component surface, the type of nozzle is chosen. It is very important to pick the correct type of nozzle and ensure no problems with the nozzle for accurate and consistent placement.
  • Vision system: The machine’s vision system checks every component to ensure that all the programmed part dimensions match, checks for any damages and programs each component with the correct tolerance parameters.
  • PCB support: The material used to make PCBs must be of adequate thickness to ensure proper support. Any inconsistency can challenge the component placement process. If it is not well supported, the placement pressure will lead it to deflect.
  • How components are supplied: Common ways of supplying components are by using tape/reel, tubes and trays. Larger quantities don’t possess much concern as they can be directly loaded onto the machine but when in smaller quantities, they cannot be directly loaded onto the machine but rather need to be hand placed or put into a different packaging that might raise a quality concern.

As you can see, the component placement process might sound easy but is quite tedious and the above-stated aspects need to be taken care of to maintain consistency and ensure repeatable results.

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