Manufacturing a PCB is a complex task with several stages involved. From designing a PCB to assembling, one has to be critical about a number of things, such as the material being used, the design of PCB, fabrication techniques and the layering processes, and each stage needs to be properly documented. In this post, we shall discuss the details of the fabrication process. The fabrication process is quite critical and keeping in view the compact nature of modern devices, it has become even more complex.
Before initiating the fabrication, an appropriate PCB design needs to be well in place as it may impact the outcome in terms of tolerances, the level of Coefficient of Thermal Expansion, and structural reliability. The design should include details regarding drilling, layering, copper-coated layers, apertures, components, etc. A flawless design can make the work of the fabrication team much easier. Using the design specification, the actual physical board of the PCB is formed.
The process of fabrication, in itself, involves a number of techniques and processes. Firstly, layouts are made on copper-coated laminates using images as references. Excess copper is scraped off by the etching technique so that the traces and pads are clearly visible. Holes are drilled for the purpose of component mounting. Following the process, the boards are either soldered or extra protective layers are added. Markings such as logos, company name etc. are also added during the fabrication process. Then, the copper-coated surface is fine-tuned, for a perfect finishing.
These are some basic steps involved in the process of fabrication. However, the ongoing advancements in the field of science and technology pave way for further innovations that deliver more effective techniques, delivering boards with better functionality and capabilities. In addition to addressing the basic needs of a PCB, the modern PCBs are more flexible and compact in nature and have high resistance to heat and hold the capacity to withstand any environmental parameters.