loading

Blog Posts

Key Aspects to An Effective Reflow Soldering Process

06Feb
by Admin  
0

The Reflow Soldering stage consists of pasting the surface mount components to printed circuit boards (PCBs). A sticky mixture of powdered solder and flux, called the solder paste is used to stick the components. It is a simple process where the components/PCB/solder paste are pre-heated to form acceptable solder joints. But one must be careful to avoid any damage due to overheating. In addition to that, there are other aspects one must be mindful of for an effective reflow soldering process:

Suitable Reflow Soldering Machine:

A wide range of reflow soldering machines can be found in the market. Each has a distinct character depending on the required line speed and design/material of the PCB assemblies to be processed. Be sure the selected oven is of a suitable size to handle the production rate. Based on the repeatability of the process, the load factor of the oven must be checked.

Based on the design of the PCB assembly choose the possible machine with available options, (a) based on the conveyor type, which could be a mesh conveyor or an edge conveyor (b) with closed-loop control for speed of convection fans and (c) Automatic control of conveyor and centre-board-support widths.

Acceptable Reflow Profile:

Each assembly needs to be considered separately in order to create an acceptable reflow profile. The type of solder paste, PCB material & its thickness, number of layers, amount of copper within the PCB, and number  & type of surface mount components, can affect how the reflow oven is programmed.

To attain an acceptable reflow profile, initially, a sample assembly is created by connecting multiple thermocouples in a number of locations which is passed through high temperatures and then the range of temperatures across the PCB is measured. The main aim is to transfer enough heat into the assembly to melt the solder and form the solder joints without causing any damage to components or PCB.

PCB/Component Footprint Design:

For an assembly to reflow smoothly, it is important to have a balanced footprint design. Make sure the size of tracks connecting a component footprint to the other is the same in size. Also, adding copper balancing to waste areas is recommended to avoid panel wrapping.

Carefully printed PCB using a well-designed Stencil:

Consistent deposit of solder paste onto the PCB is integral to an effective reflow soldering process. Any fault at this stage can lead to undesired results. An effective stencil design can avoid errors and help proceed with an effective reflow soldering process.

Repeatable Placement of Surface Mount Components:

Even a minute variation in the placement of the components can be disastrous. The processes must be equipped enough to provide repeatably. For this one must ensure a well-maintained pick-and-place machine with component packages taught in the correct way. The placement of surface mount components must be repeatable and reliable.   

Good quality PCB, components and solder paste:

Lastly, it is very important to ensure good quality products are being used during the process. Any compromise with the quality can lead to undesirable results.

Always remember an effective reflow soldering process is key to achieving your desired PCB. Be mindful of the above aspects and always go with a trusted brand like Gelco EMS when approaching PCB relating solutions!

How To Place Components On a Circuit Board?

12Dec
by Admin  
0

Component placement is one of the initial and most important stages of PCB designing. It must be done with utmost care in order to save time and avoid rework. Here are some tips to help the designer with effective component placement.

  1. Grouping and positioning of components: One of the most important tips is to group components with similar functions together as they generate the same amount of heat and other currents, and helps in maintaining temperature levels and avoiding any damage. For instance, PMICs, convertors, LDOs etc. can be grouped as a power management section. Then based on the group dynamics, the other sections can be placed. For example, the power supply section must be placed away from digital or analogue parts, and components that generate electromagnetic noise or radiation must be kept away from more sensitive signals, this helps increase the efficiency by allowing for better control of the return path. To increase the assembly process’s efficiency and reduce positioning errors, one must ensure that the ICs are all aligned in the same direction. A simple rule is to place all the components with similar functions in my direction. Another rule to keep in mind is the distance between sections and components. This prevents dangerous interference between the mixed signals. Also, make sure a space of at least 50mil is maintained between components. Another element that should be considered while placing the components is that components that handle high-speed signals must be grouped and placed at a short distance from each other to simplify the routing of the traces.
  1. Keeping components away from heat sources: It is always suggested to avoid placing other components close to power components that generate heat. For instance, MOSFETs, IGBTs, PMICs and voltage regulators generate a fair amount of heat, sometimes the rise in temperature can affect the functioning of other components. Therefore, try placing such components away from other components.
  1. Creating solid ground planes: The uniformity of the ground plane should always be maintained as they facilitate the onset of signal and power integrity issues. In any case, where maintaining uniformity isn’t possible, be extremely cautious when placing components across the interruption as that could cause an interruption of the return path for those signals and affect the functionality of the PCB. Also, avoid an excessive number of routes as that too could cause an interruption of the return path.
  2. Placement near the PCB edges: It is always advisable to place components that require screw fixing near the edges so as to avoid unwanted contact of cables with other components. In addition to that, make sure no component is placed too close to the edge, at least a gap of 100mil between each component and the edge of the board should be maintained.
  3. Enough space for the traces: With an increasing demand for compact-size portable technology, PCBs, too are required to be of the minimum dimensions. But, it is important to not be misled and to be aware that there is a limitation to the miniaturization of circuits. While designing your PCB, ensure it is of an optimal size where enough space is left to route all the traces.
  4. Thermal management: Lastly, the thermal management of the PCB is very important. Certain components generate a considerable amount of heat during their operation. If not placed properly, this could increase the overall temperature of the board and lead to burning or other damage. To avoid this situation, such components must be placed in the centre of the PCB. This helps in the thermal management of the PCB by evenly distributing the generated heat across the board.

We hope the above-suggested tips come in handy and help you fight out the common obstacles in building an efficient PCB. Gelco always seeks to present you with the best possible solutions and expert advice.

Key Aspects of the Component Placement Process

03Nov
by Admin  
0

Once the Solder Pasting is done and properly inspected, comes the turn of Component Placement. Each component is removed from its packing using a vacuum or gripper nozzle, checked by the vision system and placed in the desired location. This is an automated system done at a very high speed. The technology used for this phase depends highly on the types and design of the PCB being manufactured.

But to achieve a reliable and repeatable process, one must be considerate of certain aspects, these are:

  • Type of data available: One must be mindful while selecting the software for designing the PCB. They must possess the ability to output various types of data. The most commonly used are the Gerber data and the ‘CAD’ data. They are standard electronics industry file formats and are best for generating placement programs. They are used to communicate design information to PCB manufacturers
  • PCB design: How a PCB is designed and panelized is important for the component placement process. Here are some considerations:
    • Panel size: The machines have a specified maximum and minimum size for the panels they can process. Ensure your panel fits within the estimated size.
    • Handling strips: It is important to penalize the PCB as mostly the components are placed too close to the edge and for the convenience of the PCB handling mechanism within the various machines.
    • Fiducial marks: Simple shapes are placed within the track layer of the PCB, called the Fiducial marks. They help in avoiding any confusion of aspects and enable accurate positioning of all the components on the design board.
    • Component size and position: The components might vary in size, therefore using program optimizing software, one must ensure that the smaller components are placed before the larger ones to avoid any disturbance.
  • Nozzles: Nozzles are used to hold the component securely between the picking and placement steps. Based on the component surface, the type of nozzle is chosen. It is very important to pick the correct type of nozzle and ensure no problems with the nozzle for accurate and consistent placement.
  • Vision system: The machine’s vision system checks every component to ensure that all the programmed part dimensions match, checks for any damages and programs each component with the correct tolerance parameters.
  • PCB support: The material used to make PCBs must be of adequate thickness to ensure proper support. Any inconsistency can challenge the component placement process. If it is not well supported, the placement pressure will lead it to deflect.
  • How components are supplied: Common ways of supplying components are by using tape/reel, tubes and trays. Larger quantities don’t possess much concern as they can be directly loaded onto the machine but when in smaller quantities, they cannot be directly loaded onto the machine but rather need to be hand placed or put into a different packaging that might raise a quality concern.

As you can see, the component placement process might sound easy but is quite tedious and the above-stated aspects need to be taken care of to maintain consistency and ensure repeatable results.

Develop An Optimum Solder Paste Printing Process: 3d Solder Paste Inspection

05Oct
by Admin  
0

The printing stage of the assembly process is vitally important. If any errors occur during this stage, it can affect the entire assembly process. To develop the optimum solder paste printing process it is essential to fully inspect every printed PCB before starting the component placement process. There are two main methods of inspecting printed PCBs which are 2D and 3D.

Mostly, the solder printing machines contain a 2D solder inspection system but the 2D inspection has its own limitations. Though it has been used for a long time now but it has a limited inspection capability of area coverage and shorts. The system falls short of checking the expected solder paste volume and shape of solder deposits. On the other hand, the 3D solder inspection system is capable of adequately checking for solder paste area coverage and shorts and measuring the shape and volume of the solder paste deposits. 

For an effective 3D solder paste inspection process, certain parameters need to be kept in mind, let’s discuss the same.

  1. It is important to have data that exactly represents the stencil being used and so the expected solder paste deposits. The modified data that is used to manufacture the stencil is the data needed for the programming of solder paste inspection machines and so should be requested to make the process as easy as possible.
  2. The inspection speed is an important factor when using the SPI machine for a high-speed production line. Most machines will have a specified inspection speed to ensure the machine selected is capable of keeping up with the processing time of the largest board to be processed.
  3. Based on the sensor and lighting technology, the cost of the solder paste inspection machines can vary greatly. Look out for certain features and the number of projectors installed within the machine for repeatability and accuracy.
  4. When processing large batch numbers it is important to consider the ability to connect the SPI machine to the printer. This enables automatic adjustment of certain parameters such as the alignment.  By doing this the two machines act as one and need less operator interaction. 
  5. The graphical user interface is important to get the most from the machine selected. It enables ease of use and understanding of the information displayed.
  6. Lastly, it is important to control the solder paste printing process and its effect on the complete process. If a defect is not detected during the early stages, the investment in a 3D solder paste inspection machine should be seriously considered.

With ever-increasing complexities and the components becoming smaller, controlling the solder paste printing process is becoming a tedious job. This has raised the demand for an automated inspection process. Solder paste inspection machines are a significant investment but the benefits of tightly controlling the manufacturing process will pay back in the long term by reducing rework and improving yield.

Key Considerations of An Effective Solder Paste Printing Process

04Sep
by Admin  
0

As discussed in our earlier blogs, Solder Paste Printing is one of the key stages of the SMT process. In this stage, the Solder Paste is evenly applied to the PCB or the Printed Circuit Board using a stencil or foil or through jet printing. If the Solder paste isn’t properly applied, it could lead to major assembly defects.

For an effective solder paste printing process, certain parameters need to be kept in mind, let’s discuss the same.

  1. Speed, Pressure & Angle of the Squeegee Blade: The speed, pressure and angle at which the Squeegee blade is placed are essential parameters to determine the ideal Solder Paste application. The speed, for example, determines the available time for the solder paste to roll into the apertures of the stencil and onto the pads of the PCB. Similarly, sufficient pressure across the entire squeegee blade length ensures a clean wipe of the stencil. Low pressure can cause smearing of the paste on the stencil whereas too much pressure can cause bleeding of the paste between the stencil and PCB. Usually, the squeegee blade is placed at an angle of 60 degrees, more than that can cause scooping of the holder paste and a lesser angle can cause a residue deposit of solder paste on the stencil after the squeegee has completed a print.
  2. Stencil Separation Speed: After printing, the speed at which the stencil is separated from the PCB is the Stencil Separation Speed. It is determined by the size of the apertures within the stencil. Usually, a speed setting of up to 3mm per second is considered ideal. Anything faster than this can cause ‘dog ears’ i.e. formation of high edges around the deposits.
  3. Stencil Cleaning: One must be mindful of cleaning the stencil regularly. Many automatic machines have the in-built command of cleaning the stencil after a fixed number of prints. It can also be cleaned using lint-free material applied with cleaning chemicals. If not cleaned regularly, it can cause bleeding on the underside of the stencil and block the apparatus.
  4. Condition of the Stencil & Squeegee Blade: In addition to cleaning the stencil and the squeegee blade, one must also be mindful of the storage when not in use. The stencil and the squeegee blade must be carefully stored to avoid any damage as it can lead to undesired results. Prior to using either, they must be thoroughly checked and if any damage is noticed, they must be replaced to ensure a reliable and repeatable process.
  5. PCB Support during Printing Process: It is important to ensure that the PCB is well supported during the printing process. Usually, supports are provided with printing machines which can be fixed at specific heights and have programmable positions to ensure a consistent process. If the PCB is not fully supported it can lead to printing defects such as a poor paste deposit and smudging.
  6. Adequate Print Stroke: Print stroke is the distance the squeegee travels across the stencil and rolls back to generate the downward force that drives the paste into the apertures. The distance the squeegee travels is recommended to be a minimum of 20mm past the furthest aperture to allow enough space for the paste to roll on the return stroke.
  7. 2D /3D Inspection of the Process: The process must be verified using automated inspection which is usually of two types – 2D inspection which checks the area of the paste deposit and 3D inspection which checks the volume of the paste deposit. Inspection is required to accurately check solder paste deposits.

The printing stage of the assembly process is vitally important. If any errors occur during this stage, it can affect the entire assembly process. To develop the optimum solder paste printing process it is essential to consider all aspects of the process detailed above.

All That You Should Know About Bare Board Testing!

04Aug
by Admin  
0

When it comes to PCBs, there is an essential step that often goes ignored. We are usually so occupied with the design, application and components & their placement that we forget about the most important element of the PCB i.e. the Bare Board. As discussed in our previous blogs, we run extra tests or are extra cautious to ensure the proper placement of the components but shouldn’t we cross-check the Bare Board for any defects?

A Bare Board refers to the state of the PCB consisting of the substrate, metal coating, conductive pathways and patterns but not electronic components or through holes. In simple words, it is a printed circuited board without any components on it. To check for any defects such as opens (over etchings), shorts (under-etchings), and holes, a bare board needs to be tested. It is done prior to attaching any components. This is tested in two stages:

  • Isolation Testing: It involves checking the stability between interconnected pads. Verifying that the required resistance between two separate electrical connections is met.
  • Continuity Testing: It checks for complete isolation between individual circuit patterns so that there are no open points within the circuit.

Methods of Bare Board Testing:

Either of the two methods is used for Bare Board Testing.

  • Pinned Fixture Test: Spring-loaded pogo pins are used to test the board’s connective surfaces. Pressure is applied through the top and bottom plates to ensure the connection. It has proven to be an efficient method as it is capable of testing multiple points at the same time, saving time and energy. Also, it doesn’t take only a few seconds to perform the test once the pins are fixed.
  • Flying Probe Test: two robotic arms equipped with poles, guided by software instructions are used to verify the board’s connectivity. The flying probes travel across the board testing various connections. It may take longer than the Pinned Fixture Test but is a comparatively more flexible and affordable option.

Importance of Bare Board Testing:

It is important to test a Bare Board for any defects that may disrupt the PCB functioning. It helps ensure the reliability of the PCB. It is important to know that your bare PCB is solid before you start soldering expensive components on top of it. Especially if you’re dealing with SMTs and fine line mounting technologies.

While it may seem to be a task, but investing some time, money and effort into bare board testing can save you time and money in the longer run by avoiding field testing, repair, and maintenance costs further down the line. So make sure to test your Bare Board to avoid further regrets.

Understanding The Stages of The Surface Mount Process

01Jul
by Admin  
0

Surface Mount Technology has revolutionised the PCB designing process. Its on-surface mounting technique has given way to developing complex circuits with compact assemblies at a lesser cost. It makes use of SMD i.e. the Surface Mount Device which are electronic components used within the surface mount assembly process, they come in various shapes and sizes.

The Surface Mount Process starts with the designing of the PCB when based on the requirements, the components are selected and a layout is created. Once the design is finalised, the PCB is sent for manufacturing and the suited components are bought in to facilitate automation.

Stages of Surface Mount Process:
  • Machine Programming: After receiving the PCB panel and the components, the machines to be used are set up and programmed using CAD and Gerber data.
  • Solder paste Printing: The Solder Paste Printer uses stencil and squeegees to apply solder paste to the appropriate pads on the PCB. Nowadays, jet printers are making their way as post-printing modifications are more convenient. This is a critical phase, so be sure of any defects and unidentified defects will lead to defects further down the line.
  • Solder Paste Inspection: Based on the PCB design, there can be a separate machine used for the inspection or the solder printing machine can have the option of automated inspection. 2D and 3D technologies are used to enable a more thorough inspection of the print area including solder paste volume per pad.
  • Component Placement: The next step is placing the components where each component is removed from its packing using a vacuum or gripper nozzle, checked by the vision system and placed in the desired location. This is an automated system done at a very high speed. The technology used for this phase depends highly on the types and design of the PCB being manufactured.
  • Pre-Reflow Automated Optical Inspection: Once all the components are placed, the AOI i.e. Automated Optical Inspection machine is used to verify if all the components have been correctly placed.
  • First Article Inspection: The phase involves re-checking the first assembly design for any errors or defects. In the case of sub-contractors, they must get the first assembly verified by their customers. It might be time-consuming but is a very important step as any defect gone unnoticed can lead to high volumes of re-work.
  • Reflow Soldering: Once the component placement has been checked and verified, the PCB assembly moves into the soldering phase. The board is put into the reflow soldering machine where the PCB is heated to the desired temperature to form electrical solder connections between the components and PCB. The phase isn’t that complicated but the temperature needs to be managed to ensure acceptable solder joints without damaging the parts or assembly.
  • Post-Reflow Automated Optical Inspection: After the reflow Soldering, using the AOI machine the components are again checked for any errors or defects.
  • Process Verification using X-Ray Inspection: As many solder joints are hidden, there is a need to re-investigate the PCB using an X-Ray machine. X-Ray inspection provides a way to check underneath components such as BGA’s, the amount of voiding present within solder joints and also can be used to verify the solder hole fill after the soldering process.
  • Washing and Drying: Once the entire PCB is built and tested well, it is finally washed and dried before being packed and shipped for delivery.

PCB manufacturing using the SMT is an automated system requiring minimal human intervention. But setting up the required machinery and software, verification of errors and component quality assurance does require expertise. That is why it is always suggested to choose a reputed brand like Gelco EMS for your PCB requirements.

Surface Mount Technology For Your Pcb!

03Jun
by Admin  
0

There are several different techniques used to assemble PCBs and Surface Mount Technology is considered the most preferred of them all. But what is Surface Mount Technology and why is it an ideal option for your PCB?

Surface Mount Technology or SMT, as the name suggests is the mounting technique through which electrical components are directly mounted on the surface of the PCB. The conventional mounting technologies inserted the electrical components in a PCB through holes which would consume much space on a PCB. Whereas the SMT enables mounting on the surface itself giving way to optimal usage of the PCB space and reduction of wastage; allowing compact size PCBs. In addition to that, it also reduced the manufacturing cost and increased the scope of manufacturing automation.

Advantages

  • Components per unit area: Usage of limited space leaves room for additional components, therefore resulting in higher component density. Also, components can be placed on both sides of the PCB.
  • Component Connections: As the technique doesn’t involve holes which block the routing space in the inner and the backside layers, many more connections per component can be adjusted.
  • Scope for Correction: Minor errors in component placement are fixed automatically during the soldering process as the molten solder pulls components into alignment with solder pads. The same isn’t possible in a conventional through hole mechanism as once the leads are drawn through the holes, the components are fully aligned and cannot move laterally out of alignment.
  • Under Stress Performance: Due to lower mass and lesser cantilevering, the SMT designed PCBs have shown better mechanical performance under stress situations like in case of a shock or vibrations.
  • EMC Performance: The smaller radiation loop and lesser lead inductance results in lower radiated emissions, therefore better EMC Performance.
  • Efficient Solution: In comparison to a through hole mechanism, the SMT proves more efficient in terms of costing and time consumption. It is an automated process so is a simpler and faster technique.

Disadvantages

The SMT might prove effective in many terms but it has its own set of disadvantages. With the smaller sizes and lead spacings of the SMT devised PCBs, manual prototype assembly or component-level repair can be a costly affair requiring skilled operators and more expensive tools. Also, this puts the reliability of solder joints to question. The compact size leaves no space for markings, due to which the marked ID codes or the component values need to be more cryptic and smaller that are impossible to read normally and require magnification.

The SMT might have its own set of disadvantages but overall, the introduction of this technology has revolutionised the PCB designing process, giving way to building highly complex electronic circuits with compact assemblies and good repeatability due to the higher level of automation at a lesser cost.

Why are Prototype Circuit Boards Needed?

02May
by Admin  
0

A prototype is an early sample of the product built to evaluate the intended design. It helps in testing the concept of the product intended, checking the processes involved and analysing the functionality of the product. Before manufacturing a PCB, it is always suggested to build a prototype circuit board to examine the functionality of the intended final PCB (Printed Circuit Board). It is always better to check the functionality of the final PCB before making it available in the market for the customers, therefore, keeping in mind the application of the printed circuit boards and the applicable benefits, build a prototype before getting into the actual manufacturing stage.

Let’s discuss the added benefits of building a prototype before manufacturing the intended product.

  • Simplifies and Fastens the Manufacturing Process: A prototype gives you the exact idea of the processes involved and the material needed. It is already tried and tested, making the manufacturing process simple and swift. Once you are well aware and already trained for the involved steps, it won’t take much time for you to construct the original PCB.
  • Helps in Better Understanding of the Circuit Board: A prototype helps you understand the functionality, operational abilities, risks, limitations, and scope of application of the end product. It also gives you a clear picture of how the circuit would work. A better understanding of circuit boards is beneficial for the manufacturers, dealers and customers.
  • Leaves Room for Improvements: Helps the customers or the manufacturers to detect or identify any loopholes at an early stage. It is also ideal for running tests and analysing its functionality which leaves enough room for including improvisations.
  • Cost-effective: At times, the customer isn’t satisfied with the final product, making changes and deviations in the final product can be quite expensive and time-consuming. Improvisations made on the prototype can be included in the final product but if the product is created, there is no scope for any improvisation or changes. The problems double if a large volume of production is involved. Thus, it is imperative for the customers to approve the prototype PCB before opting for the production of the final PCB units. Creating a prototype can save you from such losses.
  • Convenience for both Buyer & Manufacturer: It is always an ideal situation when both manufacturer and the customer are sure of the end product. Prototypes help in better understanding of the product and open the opportunity for improvisation which can be convenient for customers as they can analyse the functionality and improvise the design based on their needs without the manufacturer having to bear any losses. It creates a win-win situation for the parties.

Everyone expects to purchase and supply products with perfect functional value and exacting features with efficient performance. In order to achieve this end, it is imperative to analyze the quality, efficiency, and performance, of the final PCB. This cannot be served by assessing the circuit diagram of the PCB. A prototype is created from the diagram wherein the functionality is assessed, further developments are included and improvements are analyzed. Enabling 100% design satisfaction.

But always be sure to contact trusted brands like Gelco EMS when it comes to designing or manufactering a prototype or even the final Printer Circuit Board.

Standard Spec & Custom Spec PCBs: Know the difference!

04Apr
by Admin  
0

Confused whether to order your PSB as a standard spec or a custom spec, Gelco EMS is here to make the decision easy for you by highlighting the major differences between the two. Printed circuit boards are manufactured based on the designing specifications, called specs. There are two kinds of specs identified: the standard spec i.e the pre-defined specifications, and the custom spec. Let’s discuss the basic differences between Standard Spec and Custom Spec PCBs.

Standard Spec consists of pre-defined specifications that limit the opportunity for any personal customisation. They are inspected to IPC class 2 standards and have a fixed minimum size for plated holes. The soldermask usually comes in the colour green with a white legend silkscreen.  They have a Lead-Free HAL Solder plating finish with the Rout Tolerance of +/- 0.010” and the Hole Tolerance of +/- 0.005”.

A Custom Spec doesn’t consist of any pre-defined specifications that add to the opportunity for any personal customisation. You can specify your design requirements as per the pattern of the PCBs. They are inspected to either IPC class 2 or IPC Class 3 standards and can have plated as well as non-plated holes. Also, the soldermask can be of any colour of your choice with multicoloured options for the silkscreen as well. They have both Leaded and Lead-Free HAL Solder plating finish with the Rout Tolerance of +/- 0.010” but can be made of +/- 0.005 upon request and the Hole Tolerance of +/- 0.003”. Electrolytic Hard Gold plating finish with other plating finishes options of ENIG, Immersion Silver, and OSP are also available.

The fabrication techniques and quality checks for both Standard Spec and Custom Spec PCBs remain the same. Gelco EMS has been a trusted brand for manufacturing superior quality printed circuit boards. We provide you with nothing but the best!

Popular Posts

06Nov
by Admin
0
The Benefits of Choosing Custom Circuit Boards
Printed circuit boards (PCBs) are the backbone of almost every electronic and electromechanical device. Over...
07Nov
by Admin
0
Pcbs and It’s Types
PCBs stand for Printed Circuit Boards that act as functional blocks for most of the...

Quality Solutions

Free Consultations

 +91 95102 14492

  • Phone: +91 95102 14492
  • Email: info@gelcoems.com

Company

Solutions

Solutions

  • Phone: +91 95102 14492
  • Email: info@gelcoems.com

© 2024 Gelco Electronics Private Limited. All Rights Reserved