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POST-AOI Automation: What Are Your Options?

08May
by Admin  
0

In the electronics industry, maximizing production profitability is a constant concern for manufacturers, regardless of their size or degree of automation. One area where significant gains can be made is in the automation of post-AOI processes. In this article, we will discuss the options available for optimizing post-AOI automation processes and their potential benefits.

The first and most important step in improving post-AOI automation is moving from batch AOI to inline AOI. While batch systems may be cheaper initially, the costs of a skilled operator’s wages over the lifetime of the machine are much higher than an inline system, which requires far less human intervention.

Once the inline AOI system is in place, there are several options available for post-AOI automation:

NG Conveyor and NG Workstation:

The most common method for separating NG (non-good) PCBAs from good PCBAs is the NG Conveyor. These conveyors have a pin lift mechanism that moves NG PCBAs from the good transfer conveyor to the NG position above. NG Conveyors can be equipped with up to three NG positions, and alarms can be set to signal line operators to remove the NG PCBAs for processing.

NG Workstations provide additional automation by bringing the review station to the SMT line. The workstation is equipped with a review station screen and PC, a mounted optical camera, and a screen on a floating X, Y gantry, allowing for all processing and reviews to take place on the line.

NG Buffer:

The NG Magazine Buffer is popular among OEM manufacturers and CEMs with high automation or throughput ambitions. This unit offloads perpendicular to the SMT line and provides the highest level of automation and efficiency, allowing full magazine racks to be taken to the review station and reviewed in bulk for processing. Alarms can be set to reduce unwanted scrap, which will pause production.

Split End of Line Unloader:

This option is great for those who want the functionality of the NG Buffer but do not have the floor space or budget to invest in one. With a PLC modification to an unloader immediately downstream from AOI, certain magazine positions can be allocated to NG products, which can be separated from GD (good) products and sent to review. If there are more NG PCBAs than slots, the unloader moves to the next empty rack to avoid human error on separation.

In conclusion, as boards become more complex, the inspection process’s accuracy and automation become increasingly important to ensure electronic components’ longevity. The limitations of optical inspection systems cannot be overlooked, as they can cause false calls and escapes. 3D AOI systems are the answer, but it is crucial to look for systems that combine technologies with superior hardware to provide true 3D optical inspection solutions and help guarantee that the inspection process is faultless. By optimising post-AOI automation, manufacturers can increase their profitability while ensuring high-quality electronic components.

Difference Between 2D & 3D AOI

06Apr
by Admin  
0

AOI stands for Automated Optical Inspection, which is a process used in the electronics industry to inspect printed circuit boards (PCBs) for defects. AOI machines use high-resolution cameras and sophisticated image analysis software to detect various types of defects, such as missing components, misaligned parts, soldering defects, and other issues that can impact the functionality and reliability of the PCB.

There are two main types of AOI systems: 2D AOI and 3D AOI. The main difference between them is the way they capture and process images of the PCB. But let’s peek into some common differences between the two:

  1. Image capture: In 2D AOI, the camera captures 2D images of the PCB from a single viewpoint, while in 3D AOI, the camera captures multiple images of the PCB from different angles, allowing the software to create a 3D model of the board.
  2. Depth perception: 2D AOI has limited depth perception since it captures images from a single viewpoint. This makes it difficult to detect defects in complex or densely populated PCBs. In contrast, 3D AOI has much better depth perception, making it easier to detect defects that are hidden from a single viewpoint.
  3. Speed: 2D AOI is generally faster than 3D AOI since it captures images from a single viewpoint. This makes it more suitable for high-volume production lines where speed is critical.
  4. Accuracy: 3D AOI is generally more accurate than 2D AOI since it can detect defects that are hidden from a single viewpoint. This makes it more suitable for applications that require a high level of accuracy.
  5. Cost: 3D AOI is generally more expensive than 2D AOI since it requires more sophisticated hardware and software. This makes it less suitable for applications that require a lower cost of production.

In summary, 2D AOI is faster and less expensive, but has limited depth perception, while 3D AOI is slower and more expensive, but provides better depth perception and accuracy. The choice between the two depends on the specific needs of the application, including the complexity of the PCB, the required inspection speed and accuracy, and the cost of production.

Automated Optical Inspection (Aoi)

08Mar
by Admin  
0

Automated Optical Inspection or the AOI process is the method of inspection gaining popularity with the increasing usage of microelectronics. Over time, it has become an integral solution for the SMT industry. But what exactly is the AOI process?

As the name suggests, it is an automated visual inspection of the PCB in manufacturing. Post the assembly of components on the PCB, it is important to inspect it for any defects. For this, the AOI machine is used. The Air machine is equipped with a camera system to scan for any defects on the board which could further lead to board failure. It can be used at any stage of manufacturing i.e. pre or post-reflow or during both to ensure a flawless placement of PCB.

AOI inspects the PCB for any area defects. It helps ensure accurate component placement by identifying any component offset, absence or presence of components, component skew, flipped or severely damaged components. It also checks the solder joints for excessive or missing solder joints and ensures that there isn’t any wrong part or foreign element present on the PCB.

Types of AOI Inspection

AOI processors are available in two categories, the 3D AOI which is the latest version and its predecessor i.e. the 2D AOI, which was introduced somewhere in the early 1980s.  Despite being an age-old technology, with regular modifications, the 2D AOI is still very much dominating the market. However, the increasing complexity of PCB and reduced size of the PCBs have put 3D AOI ahead of 2D AOI.

  • 2D AOI: It is the most commonly used technology with multiple high-resolution cameras, 10 to 15 MP resolution, and precise lenses equipped to inspect tall devices of more than 5mm. The technology makes use of sophisticated inspection algorithms to detect any possible defects on the PCB. It is highly in demand because of its flexible inspection capabilities and is cost-effective. But it stands incapable of providing volumetric measurement data and true-co-planarity inspection.
  • 3D AOI: It is the latest technology that uses laser measurement especially to provide a 3D measurement of height-sensitive devices. Over years, it has been used mostly to inspect solder paste deposition on PCBs right after the screen-printing process. It comes in handy in detecting co-planarity defects that may have been ignored when inspecting through the 2D AOI process. It has a lesser false call rate than the 2D AOI and is capable of providing volumetric measurement data and true-co-planarity inspection. But it is an emerging technology with shadowing issues and high cost.

Whether it is the 2D AOI or the 3D AOI Technology, both aid in ensuring the quality of the PCB by providing incomparable reliability, especially in the case of complex boards with thousands of solder joints and intricate components.

Key Aspects to An Effective Reflow Soldering Process

06Feb
by Admin  
0

The Reflow Soldering stage consists of pasting the surface mount components to printed circuit boards (PCBs). A sticky mixture of powdered solder and flux, called the solder paste is used to stick the components. It is a simple process where the components/PCB/solder paste are pre-heated to form acceptable solder joints. But one must be careful to avoid any damage due to overheating. In addition to that, there are other aspects one must be mindful of for an effective reflow soldering process:

Suitable Reflow Soldering Machine:

A wide range of reflow soldering machines can be found in the market. Each has a distinct character depending on the required line speed and design/material of the PCB assemblies to be processed. Be sure the selected oven is of a suitable size to handle the production rate. Based on the repeatability of the process, the load factor of the oven must be checked.

Based on the design of the PCB assembly choose the possible machine with available options, (a) based on the conveyor type, which could be a mesh conveyor or an edge conveyor (b) with closed-loop control for speed of convection fans and (c) Automatic control of conveyor and centre-board-support widths.

Acceptable Reflow Profile:

Each assembly needs to be considered separately in order to create an acceptable reflow profile. The type of solder paste, PCB material & its thickness, number of layers, amount of copper within the PCB, and number  & type of surface mount components, can affect how the reflow oven is programmed.

To attain an acceptable reflow profile, initially, a sample assembly is created by connecting multiple thermocouples in a number of locations which is passed through high temperatures and then the range of temperatures across the PCB is measured. The main aim is to transfer enough heat into the assembly to melt the solder and form the solder joints without causing any damage to components or PCB.

PCB/Component Footprint Design:

For an assembly to reflow smoothly, it is important to have a balanced footprint design. Make sure the size of tracks connecting a component footprint to the other is the same in size. Also, adding copper balancing to waste areas is recommended to avoid panel wrapping.

Carefully printed PCB using a well-designed Stencil:

Consistent deposit of solder paste onto the PCB is integral to an effective reflow soldering process. Any fault at this stage can lead to undesired results. An effective stencil design can avoid errors and help proceed with an effective reflow soldering process.

Repeatable Placement of Surface Mount Components:

Even a minute variation in the placement of the components can be disastrous. The processes must be equipped enough to provide repeatably. For this one must ensure a well-maintained pick-and-place machine with component packages taught in the correct way. The placement of surface mount components must be repeatable and reliable.   

Good quality PCB, components and solder paste:

Lastly, it is very important to ensure good quality products are being used during the process. Any compromise with the quality can lead to undesirable results.

Always remember an effective reflow soldering process is key to achieving your desired PCB. Be mindful of the above aspects and always go with a trusted brand like Gelco EMS when approaching PCB relating solutions!

How To Place Components On a Circuit Board?

12Dec
by Admin  
0

Component placement is one of the initial and most important stages of PCB designing. It must be done with utmost care in order to save time and avoid rework. Here are some tips to help the designer with effective component placement.

  1. Grouping and positioning of components: One of the most important tips is to group components with similar functions together as they generate the same amount of heat and other currents, and helps in maintaining temperature levels and avoiding any damage. For instance, PMICs, convertors, LDOs etc. can be grouped as a power management section. Then based on the group dynamics, the other sections can be placed. For example, the power supply section must be placed away from digital or analogue parts, and components that generate electromagnetic noise or radiation must be kept away from more sensitive signals, this helps increase the efficiency by allowing for better control of the return path. To increase the assembly process’s efficiency and reduce positioning errors, one must ensure that the ICs are all aligned in the same direction. A simple rule is to place all the components with similar functions in my direction. Another rule to keep in mind is the distance between sections and components. This prevents dangerous interference between the mixed signals. Also, make sure a space of at least 50mil is maintained between components. Another element that should be considered while placing the components is that components that handle high-speed signals must be grouped and placed at a short distance from each other to simplify the routing of the traces.
  1. Keeping components away from heat sources: It is always suggested to avoid placing other components close to power components that generate heat. For instance, MOSFETs, IGBTs, PMICs and voltage regulators generate a fair amount of heat, sometimes the rise in temperature can affect the functioning of other components. Therefore, try placing such components away from other components.
  1. Creating solid ground planes: The uniformity of the ground plane should always be maintained as they facilitate the onset of signal and power integrity issues. In any case, where maintaining uniformity isn’t possible, be extremely cautious when placing components across the interruption as that could cause an interruption of the return path for those signals and affect the functionality of the PCB. Also, avoid an excessive number of routes as that too could cause an interruption of the return path.
  2. Placement near the PCB edges: It is always advisable to place components that require screw fixing near the edges so as to avoid unwanted contact of cables with other components. In addition to that, make sure no component is placed too close to the edge, at least a gap of 100mil between each component and the edge of the board should be maintained.
  3. Enough space for the traces: With an increasing demand for compact-size portable technology, PCBs, too are required to be of the minimum dimensions. But, it is important to not be misled and to be aware that there is a limitation to the miniaturization of circuits. While designing your PCB, ensure it is of an optimal size where enough space is left to route all the traces.
  4. Thermal management: Lastly, the thermal management of the PCB is very important. Certain components generate a considerable amount of heat during their operation. If not placed properly, this could increase the overall temperature of the board and lead to burning or other damage. To avoid this situation, such components must be placed in the centre of the PCB. This helps in the thermal management of the PCB by evenly distributing the generated heat across the board.

We hope the above-suggested tips come in handy and help you fight out the common obstacles in building an efficient PCB. Gelco always seeks to present you with the best possible solutions and expert advice.

Key Aspects of the Component Placement Process

03Nov
by Admin  
0

Once the Solder Pasting is done and properly inspected, comes the turn of Component Placement. Each component is removed from its packing using a vacuum or gripper nozzle, checked by the vision system and placed in the desired location. This is an automated system done at a very high speed. The technology used for this phase depends highly on the types and design of the PCB being manufactured.

But to achieve a reliable and repeatable process, one must be considerate of certain aspects, these are:

  • Type of data available: One must be mindful while selecting the software for designing the PCB. They must possess the ability to output various types of data. The most commonly used are the Gerber data and the ‘CAD’ data. They are standard electronics industry file formats and are best for generating placement programs. They are used to communicate design information to PCB manufacturers
  • PCB design: How a PCB is designed and panelized is important for the component placement process. Here are some considerations:
    • Panel size: The machines have a specified maximum and minimum size for the panels they can process. Ensure your panel fits within the estimated size.
    • Handling strips: It is important to penalize the PCB as mostly the components are placed too close to the edge and for the convenience of the PCB handling mechanism within the various machines.
    • Fiducial marks: Simple shapes are placed within the track layer of the PCB, called the Fiducial marks. They help in avoiding any confusion of aspects and enable accurate positioning of all the components on the design board.
    • Component size and position: The components might vary in size, therefore using program optimizing software, one must ensure that the smaller components are placed before the larger ones to avoid any disturbance.
  • Nozzles: Nozzles are used to hold the component securely between the picking and placement steps. Based on the component surface, the type of nozzle is chosen. It is very important to pick the correct type of nozzle and ensure no problems with the nozzle for accurate and consistent placement.
  • Vision system: The machine’s vision system checks every component to ensure that all the programmed part dimensions match, checks for any damages and programs each component with the correct tolerance parameters.
  • PCB support: The material used to make PCBs must be of adequate thickness to ensure proper support. Any inconsistency can challenge the component placement process. If it is not well supported, the placement pressure will lead it to deflect.
  • How components are supplied: Common ways of supplying components are by using tape/reel, tubes and trays. Larger quantities don’t possess much concern as they can be directly loaded onto the machine but when in smaller quantities, they cannot be directly loaded onto the machine but rather need to be hand placed or put into a different packaging that might raise a quality concern.

As you can see, the component placement process might sound easy but is quite tedious and the above-stated aspects need to be taken care of to maintain consistency and ensure repeatable results.

Develop An Optimum Solder Paste Printing Process: 3d Solder Paste Inspection

05Oct
by Admin  
0

The printing stage of the assembly process is vitally important. If any errors occur during this stage, it can affect the entire assembly process. To develop the optimum solder paste printing process it is essential to fully inspect every printed PCB before starting the component placement process. There are two main methods of inspecting printed PCBs which are 2D and 3D.

Mostly, the solder printing machines contain a 2D solder inspection system but the 2D inspection has its own limitations. Though it has been used for a long time now but it has a limited inspection capability of area coverage and shorts. The system falls short of checking the expected solder paste volume and shape of solder deposits. On the other hand, the 3D solder inspection system is capable of adequately checking for solder paste area coverage and shorts and measuring the shape and volume of the solder paste deposits. 

For an effective 3D solder paste inspection process, certain parameters need to be kept in mind, let’s discuss the same.

  1. It is important to have data that exactly represents the stencil being used and so the expected solder paste deposits. The modified data that is used to manufacture the stencil is the data needed for the programming of solder paste inspection machines and so should be requested to make the process as easy as possible.
  2. The inspection speed is an important factor when using the SPI machine for a high-speed production line. Most machines will have a specified inspection speed to ensure the machine selected is capable of keeping up with the processing time of the largest board to be processed.
  3. Based on the sensor and lighting technology, the cost of the solder paste inspection machines can vary greatly. Look out for certain features and the number of projectors installed within the machine for repeatability and accuracy.
  4. When processing large batch numbers it is important to consider the ability to connect the SPI machine to the printer. This enables automatic adjustment of certain parameters such as the alignment.  By doing this the two machines act as one and need less operator interaction. 
  5. The graphical user interface is important to get the most from the machine selected. It enables ease of use and understanding of the information displayed.
  6. Lastly, it is important to control the solder paste printing process and its effect on the complete process. If a defect is not detected during the early stages, the investment in a 3D solder paste inspection machine should be seriously considered.

With ever-increasing complexities and the components becoming smaller, controlling the solder paste printing process is becoming a tedious job. This has raised the demand for an automated inspection process. Solder paste inspection machines are a significant investment but the benefits of tightly controlling the manufacturing process will pay back in the long term by reducing rework and improving yield.

Key Considerations of An Effective Solder Paste Printing Process

04Sep
by Admin  
0

As discussed in our earlier blogs, Solder Paste Printing is one of the key stages of the SMT process. In this stage, the Solder Paste is evenly applied to the PCB or the Printed Circuit Board using a stencil or foil or through jet printing. If the Solder paste isn’t properly applied, it could lead to major assembly defects.

For an effective solder paste printing process, certain parameters need to be kept in mind, let’s discuss the same.

  1. Speed, Pressure & Angle of the Squeegee Blade: The speed, pressure and angle at which the Squeegee blade is placed are essential parameters to determine the ideal Solder Paste application. The speed, for example, determines the available time for the solder paste to roll into the apertures of the stencil and onto the pads of the PCB. Similarly, sufficient pressure across the entire squeegee blade length ensures a clean wipe of the stencil. Low pressure can cause smearing of the paste on the stencil whereas too much pressure can cause bleeding of the paste between the stencil and PCB. Usually, the squeegee blade is placed at an angle of 60 degrees, more than that can cause scooping of the holder paste and a lesser angle can cause a residue deposit of solder paste on the stencil after the squeegee has completed a print.
  2. Stencil Separation Speed: After printing, the speed at which the stencil is separated from the PCB is the Stencil Separation Speed. It is determined by the size of the apertures within the stencil. Usually, a speed setting of up to 3mm per second is considered ideal. Anything faster than this can cause ‘dog ears’ i.e. formation of high edges around the deposits.
  3. Stencil Cleaning: One must be mindful of cleaning the stencil regularly. Many automatic machines have the in-built command of cleaning the stencil after a fixed number of prints. It can also be cleaned using lint-free material applied with cleaning chemicals. If not cleaned regularly, it can cause bleeding on the underside of the stencil and block the apparatus.
  4. Condition of the Stencil & Squeegee Blade: In addition to cleaning the stencil and the squeegee blade, one must also be mindful of the storage when not in use. The stencil and the squeegee blade must be carefully stored to avoid any damage as it can lead to undesired results. Prior to using either, they must be thoroughly checked and if any damage is noticed, they must be replaced to ensure a reliable and repeatable process.
  5. PCB Support during Printing Process: It is important to ensure that the PCB is well supported during the printing process. Usually, supports are provided with printing machines which can be fixed at specific heights and have programmable positions to ensure a consistent process. If the PCB is not fully supported it can lead to printing defects such as a poor paste deposit and smudging.
  6. Adequate Print Stroke: Print stroke is the distance the squeegee travels across the stencil and rolls back to generate the downward force that drives the paste into the apertures. The distance the squeegee travels is recommended to be a minimum of 20mm past the furthest aperture to allow enough space for the paste to roll on the return stroke.
  7. 2D /3D Inspection of the Process: The process must be verified using automated inspection which is usually of two types – 2D inspection which checks the area of the paste deposit and 3D inspection which checks the volume of the paste deposit. Inspection is required to accurately check solder paste deposits.

The printing stage of the assembly process is vitally important. If any errors occur during this stage, it can affect the entire assembly process. To develop the optimum solder paste printing process it is essential to consider all aspects of the process detailed above.

All That You Should Know About Bare Board Testing!

04Aug
by Admin  
0

When it comes to PCBs, there is an essential step that often goes ignored. We are usually so occupied with the design, application and components & their placement that we forget about the most important element of the PCB i.e. the Bare Board. As discussed in our previous blogs, we run extra tests or are extra cautious to ensure the proper placement of the components but shouldn’t we cross-check the Bare Board for any defects?

A Bare Board refers to the state of the PCB consisting of the substrate, metal coating, conductive pathways and patterns but not electronic components or through holes. In simple words, it is a printed circuited board without any components on it. To check for any defects such as opens (over etchings), shorts (under-etchings), and holes, a bare board needs to be tested. It is done prior to attaching any components. This is tested in two stages:

  • Isolation Testing: It involves checking the stability between interconnected pads. Verifying that the required resistance between two separate electrical connections is met.
  • Continuity Testing: It checks for complete isolation between individual circuit patterns so that there are no open points within the circuit.

Methods of Bare Board Testing:

Either of the two methods is used for Bare Board Testing.

  • Pinned Fixture Test: Spring-loaded pogo pins are used to test the board’s connective surfaces. Pressure is applied through the top and bottom plates to ensure the connection. It has proven to be an efficient method as it is capable of testing multiple points at the same time, saving time and energy. Also, it doesn’t take only a few seconds to perform the test once the pins are fixed.
  • Flying Probe Test: two robotic arms equipped with poles, guided by software instructions are used to verify the board’s connectivity. The flying probes travel across the board testing various connections. It may take longer than the Pinned Fixture Test but is a comparatively more flexible and affordable option.

Importance of Bare Board Testing:

It is important to test a Bare Board for any defects that may disrupt the PCB functioning. It helps ensure the reliability of the PCB. It is important to know that your bare PCB is solid before you start soldering expensive components on top of it. Especially if you’re dealing with SMTs and fine line mounting technologies.

While it may seem to be a task, but investing some time, money and effort into bare board testing can save you time and money in the longer run by avoiding field testing, repair, and maintenance costs further down the line. So make sure to test your Bare Board to avoid further regrets.

Understanding The Stages of The Surface Mount Process

01Jul
by Admin  
0

Surface Mount Technology has revolutionised the PCB designing process. Its on-surface mounting technique has given way to developing complex circuits with compact assemblies at a lesser cost. It makes use of SMD i.e. the Surface Mount Device which are electronic components used within the surface mount assembly process, they come in various shapes and sizes.

The Surface Mount Process starts with the designing of the PCB when based on the requirements, the components are selected and a layout is created. Once the design is finalised, the PCB is sent for manufacturing and the suited components are bought in to facilitate automation.

Stages of Surface Mount Process:
  • Machine Programming: After receiving the PCB panel and the components, the machines to be used are set up and programmed using CAD and Gerber data.
  • Solder paste Printing: The Solder Paste Printer uses stencil and squeegees to apply solder paste to the appropriate pads on the PCB. Nowadays, jet printers are making their way as post-printing modifications are more convenient. This is a critical phase, so be sure of any defects and unidentified defects will lead to defects further down the line.
  • Solder Paste Inspection: Based on the PCB design, there can be a separate machine used for the inspection or the solder printing machine can have the option of automated inspection. 2D and 3D technologies are used to enable a more thorough inspection of the print area including solder paste volume per pad.
  • Component Placement: The next step is placing the components where each component is removed from its packing using a vacuum or gripper nozzle, checked by the vision system and placed in the desired location. This is an automated system done at a very high speed. The technology used for this phase depends highly on the types and design of the PCB being manufactured.
  • Pre-Reflow Automated Optical Inspection: Once all the components are placed, the AOI i.e. Automated Optical Inspection machine is used to verify if all the components have been correctly placed.
  • First Article Inspection: The phase involves re-checking the first assembly design for any errors or defects. In the case of sub-contractors, they must get the first assembly verified by their customers. It might be time-consuming but is a very important step as any defect gone unnoticed can lead to high volumes of re-work.
  • Reflow Soldering: Once the component placement has been checked and verified, the PCB assembly moves into the soldering phase. The board is put into the reflow soldering machine where the PCB is heated to the desired temperature to form electrical solder connections between the components and PCB. The phase isn’t that complicated but the temperature needs to be managed to ensure acceptable solder joints without damaging the parts or assembly.
  • Post-Reflow Automated Optical Inspection: After the reflow Soldering, using the AOI machine the components are again checked for any errors or defects.
  • Process Verification using X-Ray Inspection: As many solder joints are hidden, there is a need to re-investigate the PCB using an X-Ray machine. X-Ray inspection provides a way to check underneath components such as BGA’s, the amount of voiding present within solder joints and also can be used to verify the solder hole fill after the soldering process.
  • Washing and Drying: Once the entire PCB is built and tested well, it is finally washed and dried before being packed and shipped for delivery.

PCB manufacturing using the SMT is an automated system requiring minimal human intervention. But setting up the required machinery and software, verification of errors and component quality assurance does require expertise. That is why it is always suggested to choose a reputed brand like Gelco EMS for your PCB requirements.

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